Forming machine for components such as safety gauge capacitor

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- Commodity name: Forming machine for components such as safety gauge capacitor
- Commodity ID: 安规电容等元件成型机
Heat sink feeding crystal automatic forming crystal automatic gluing heat sink crystal automatic complete locking and automatic discharging

Spec:

Power: 110V/220V AC. 60HZ/50HZ

Size:L500×W430×H470m/m

Weight: 37KGS.

Features:

* Plane feeding, applicable to large and small parts, can be installed.

Automatic feeding tray.

* Special cutting method, long tool life, easy adjustment.

* fiber count, set accurate. (belonging to selective accessories: counter)

* Simple operation, easy maintenance
Heat sink feeding crystal automatic forming crystal automatic gluing heat sink crystal automatic complete locking and automatic discharging

The equipment consists of a heat sink loading device, a thermal paste loading device, an IC transistor loading device, a screw feeding device and a fastening device driven by a control circuit. The heat sink loading device is arranged on the base and has a slide for the heat sink to slide along the slide to the corresponding station;

The thermal paste loading device is driven by a moving structure that can move horizontally and vertically to dip the dipping part into the thermal paste, and apply the thermal paste to the IC crystal;

The IC transistor loading device separates the IC transistors and sends them to the station one by one, sucks the IC transistors through the adsorption part set on the moving structure and installs them on the heat sink;

· The screw outlet of the screw feeding device is aligned with the fixing hole of the heat sink on the work station, and the screws are sent to the fixing hole one by one; the fastening device is located vertically above the fixing hole, and the screws are screwed and fastened in the fixing hole. The whole process takes only 2.5-3 seconds to complete.
Heat sink feeding crystal automatic forming crystal automatic gluing heat sink crystal automatic complete locking and automatic discharging

The equipment consists of a heat sink loading device, a thermal paste loading device, an IC transistor loading device, a screw feeding device and a fastening device driven by a control circuit. The heat sink loading device is arranged on the base and has a slide for the heat sink to slide along the slide to the corresponding station;

The thermal paste loading device is driven by a moving structure that can move horizontally and vertically to dip the dipping part into the thermal paste, and apply the thermal paste to the IC crystal;

The IC transistor loading device separates the IC transistors and sends them to the station one by one, sucks the IC transistors through the adsorption part set on the moving structure and installs them on the heat sink;

· The screw outlet of the screw feeding device is aligned with the fixing hole of the heat sink on the work station, and the screws are sent to the fixing hole one by one; the fastening device is located vertically above the fixing hole, and the screws are screwed and fastened in the fixing hole. The whole process takes only 2.5-3 seconds to complete.